| 1. SMT
: Ics are
placed by a high-speed
chip mounter according
to the placement |
| |
program. |
| 2. Automated
Optical Inspection
: Those parts, which are
difficult to check by
Visual |
| |
Inspection, are checked
automatically by AOI equipment. |
| 3. Manual
Insertion :
Parts are inserted on
PCB before Automated Wave
Soldering, to avoid |
| |
defects during
Manual Soldering. |
| 4. Automated
Wave Soldering
: Parts are soldered
automatically in an automatic,
inert |
| |
atmosphere soldering machine.
|
| 5. In
Circuit Test
: After a trained operator
inspects the board visually,
parameters of each |
| |
part are measured by an
in-line type ICT equipment. |
| 6. ROUTER
: PCB Assemblys are separated
using a routing machine. |
| 7. High
Temperature Aging
: Products are placed
in exclusive racks for
Environment Test. |
| 8. Final
Test : Once
passed the High Temp Aging
Test, products are submitted
to the Final |
| |
Test. |
